Thermal design of electronic equipment
Also listed as: תכנון תרמי של ציוד אלקטרוני
Keeping silicon cool, which in Israel is arguably the highest-paying direct application of mechanical engineering. Resistance networks, heat sinks, air and liquid cooling, and reliability against temperature.
- Semester
- Semester A
- Weekly hours
- 4h
- Counts as
- Department electives
- Interest areas
- Flow and thermal design · Mechanical design
Comes after
- Heat transfer
Opens up
- 0542-4135Advanced thermal design with software tools
- Packaging research
What it covers
Topics
- Heat-transfer fundamentals in an electronics context
- Junction-to-ambient thermal-resistance networks
- Conduction in packages and printed circuit boards
- Natural and forced-air convection
- Heat-sink design and selection, fin analysis and effectiveness
- Thermal interface materials
- Fans, blowers and system airflow
- Liquid cooling, heat pipes, thermoelectric coolers
- Reliability against temperature: Arrhenius, electromigration
- Transient behaviour and thermal cycling
- Thermal CFD practice
Results worth carrying out
Junction temperature
Junction-to-ambient resistance
Arrhenius acceleration factor
Figures worth knowing
- Thermal-resistance network diagrams
- Heat-sink resistance against airflow
- Temperature contour maps
- Fin-efficiency charts
Quick answers
When is Thermal design of electronic equipment taught?
Thermal design of electronic equipment (0542-4322) is taught in Semester A (fall), 4 weekly hours. It counts toward “Department electives” in the Tel Aviv University Mechanical Engineering elective requirements.
What do I need before 0542-4322?
Before Thermal design of electronic equipment you need: Heat transfer.
What software is used in Thermal design of electronic equipment?
Thermal design of electronic equipment is normally taught with ANSYS Icepak, FloTHERM, COMSOL.
Which jobs does Thermal design of electronic equipment prepare you for?
Thermal design of electronic equipment is part of the preparation for these roles: Thermal engineer, electronics cooling.
Which interest areas include Thermal design of electronic equipment?
Thermal design of electronic equipment sits in these interest areas: Flow and thermal design, Mechanical design.
Related courses
- 0542-4124Semester A · 4h
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תהליכי ייצור ועיבוד ביולוגיים
Bioprocess engineering for mechanical engineers: transport, mixing and scale-up in systems where the working fluid is alive. A route into the Israeli biotech and food-tech sector without switching degrees.
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Research project for honours students 1
פרויקט מחקר למצטיינים 1
The honours research project, and the most direct on-ramp to a thesis in the catalogue. You pick a supervisor, produce results, and frequently continue the same problem into a masters.
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Research project for honours students 2
פרויקט מחקר למצטיינים 2
The continuation of the honours project, where the results get deep enough to defend. Under the direct track this is already the first part of the masters thesis.
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Plastic forming processes in metals
מבוא לתהליכי ייצור פלסטי במתכות
Plasticity applied to forming: forging, rolling, extrusion, drawing and sheet work, with the force models and the limits that decide whether a part can be made at all.
Structures and computational mechanicsMechanical design
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The topic outlines are not official syllabi. The university publishes a catalogue blurb per course, not lecture-by-lecture material, so each outline describes what a course of that name, at those hours, with those prerequisites teaches at engineering schools generally, cross-checked against the standard textbook for the subject. Treat it as an informed map, not as a transcript of the lectures.