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0512-4700

Micro and nano electronics technologies

Also listed as: טכנולוגיות מיקרו וננו אלקטרוניקה

The process half of micro-systems: lithography, etching, deposition and integration at the scale the fabs work at. It pairs with MEMS to cover both design and manufacture.

Semester
Not fixed
Weekly hours
4h
Counts as
Faculty electives
Interest areas
Miniaturised systems and materials

Comes after

  • Electrical Engineering approval

Opens up

What it covers

Topics

  • Integrated-circuit and MEMS fabrication technologies
  • Lithography and the scaling that drives it
  • Thin-film deposition and etch processes
  • Nanofabrication techniques
  • Process integration and yield

Results worth carrying out

  • Rayleigh resolution

    CD=k1λNA,DOF=k2λNA2\mathrm{CD} = k_1 \frac{\lambda}{\mathrm{NA}}, \qquad \mathrm{DOF} = k_2 \frac{\lambda}{\mathrm{NA}^2}
  • Deal–Grove oxide growth

    xox2+Axox=B(t+τ)x_{ox}^2 + A\,x_{ox} = B\,(t + \tau)
  • Etch selectivity and anisotropy

    S=RfilmRmask,A=1RlatRvertS = \frac{R_{\text{film}}}{R_{\text{mask}}}, \qquad A = 1 - \frac{R_{\text{lat}}}{R_{\text{vert}}}

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The topic outlines are not official syllabi. The university publishes a catalogue blurb per course, not lecture-by-lecture material, so each outline describes what a course of that name, at those hours, with those prerequisites teaches at engineering schools generally, cross-checked against the standard textbook for the subject. Treat it as an informed map, not as a transcript of the lectures.